Multilayer HDI PCB Manufacturer

FOB Reference Price / Min.Order Quantity : Get Latest Prices

Processing Time:1 Days - 60 Days

Packaging Details: STANDARD EXPORTING PACKAGE

Port: Shanghai / Shenzhen / Qingdao / Ningbo / Other

Payment Terms: L/C , T/T , other

Product Details Company Profile

Multilayer HDI PCB Manufacturer

Flexible-Rigid PCB

Layer Count/Technology	4-20 layers	4-20layers
PCB Thickness Range	0.5-2.4MM	0.4-2.4MM
Build Up Technology	1-N-1 / 2-N-2 / 3-N-3 / 4-N-4	1-N-1 / 2-N-2 / 3-N-3 / 4-N-4 / 5-N-5 / 6-N-6 / 7-N-7
Min.Laser Drill Diameter	110μm	75μm
Laser Techlology	CO2 Direct Drilling（UV/CO2)	CO2 Direct Drilling（UV/CO2)
Materials	FR4/FR4 Halogen Reduced	FR4 / Taconic / Rogers / Others on request
Class Transition Temperature	140℃ / 150℃ / 170℃	140℃ / 150℃ / 170℃ / 200℃
Standard Glass Cloth	1027/106 / 1080/2116 / 1501/7628	1037/106 / 1080/2116 / 1501/7628 / 1027/
Copper Thickness	12μm/18μm/35μm/70μm	9μm/12μm/18μm/35μm/70μm/105μm
Copper Plating Holes	20μm（25μm）	13μm / 20μm / 25μm
Min. Line/ Spacing	60μm / 60μm	40μm / 40μm
Soldermask Registration	70μm	60μm
Min. Soldermask Dam	+/-38μmPhoto-imageable）	+/- 25μm（Photo-imageable）
Soldermask Color	Green / White / Black / Red / Blue	Green /White / Black / Red / Blue
Max. PCB Size	575mm × 500mm	575mm × 500mm
Production Panel	609.6mm × 530mm	609.6mm × 530mm
Min. Annular Ring	125μm	100μm
Smallest Drill	0.28mm	0.15mm
Smallest Routing Bit	0.8mm	0.8mm
Surfaces	OSP/Immersion Tin	OSP/Immersion Tin
Immersion NI/AU	Immersion NI/AU
Plated Ni/AU	Plated Ni/AU
immersion AG	immersion AG
Scoring	Yes	Yes
ID Print	White	White

We have over 15 years experience in produce PCB services and have reliable of raw material suppliers. We can find out the best source to consistently reduce your cost. Any inquiry please contact with us by info@mktpcbexportimescheck