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Boron Carbide for Sapphire Wafer Lapping
Boron Carbide for Sapphire Wafer Lapping
Boron Carbide for Sapphire Wafer Lapping
Boron Carbide for Sapphire Wafer Lapping

Boron Carbide for Sapphire Wafer Lapping

FOB Reference Price / Min.Order Quantity : Get Latest Prices

Processing Time:1 Days - 60 Days

Packaging Details: STANDARD EXPORTING PACKAGE

Port: Shanghai / Shenzhen / Qingdao / Ningbo / Other

Payment Terms: L/C , T/T , other

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carbidePlace of Origin: Jilin, China (Mainland)
Brand Name: ZHENGXING
Model Number: FEPA
Material: powder
Usage: Grinding and polishing
Abrasive Grain Sizes: All sizes
Density: 2.52g/cm3
Microscopic Hardness: 5400~6300kg/mm2
Mohs hardness: 9.36
Melthing Point: 2450 centigrade

Dunhua Zhengxing Abrasive Co., Ltd

Business Type:

Main Products: Abrasive

Location:Jilin, China (Mainland)

Total Employees: 101 - 200 People

Year Established:

Top 3 Markets:

Accepted Payment Currency:

Nearest Port:

Average Lead Time:

Overseas Office: No

Boron Carbide for Sapphire Wafer Lapping